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Improving the thickness uniformity of micro electroforming layer by megasonic agitation and the application 期刊论文
Materials Chemistry and Physics, 2020, 卷号: 239
作者:  Zhao, Ming;  Du, Liqun;  Xu, Zheng;  Zhang, Xi;  Cao, Qiang
收藏  |  浏览/下载:77/0  |  提交时间:2019/11/29
Fabrication of metal microfluidic chip mold with coplanar auxiliary cathode in the electroforming process 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2019, 卷号: 29
作者:  Zhao, Ming;  Du, Liqun;  Wei, Zhuangzhuang;  Du, Chengquan;  Liu, Xuqiang
收藏  |  浏览/下载:27/0  |  提交时间:2019/12/02
Fabrication of a multilayered optical device based on submicron polyimide film 期刊论文
PROCEEDINGS OF THE 2016 4TH INTERNATIONAL CONFERENCE ON MACHINERY, MATERIALS AND COMPUTING TECHNOLOGY, 2016, 卷号: 60, 页码: 897
作者:  Hu W(胡渭);  Chen TX(陈田祥);  Chen Y(陈勇)
收藏  |  浏览/下载:21/0  |  提交时间:2017/07/27
Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process 期刊论文
MICROMACHINES, 2016, 卷号: 7, 页码: 1-12
作者:  Du, Liqun;  Yang, Tong;  Zhao, Ming;  Tao, Yousheng;  Luo, Lei
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/09
Effect of the thickness uniformity in micro-electroforming process by dividing conductive zone on cathode 期刊论文
Advanced Materials Research, 2009, 卷号: 60-61, 页码: 202-206
作者:  Du, L.;  Yu, L.;  Song, L.;  Liu, C.
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/24
Effect of the Thickness Uniformity in Micro-electroforming Process by Dividing Conductive Zone on Cathode 会议论文
1st International Conference of Chinese-Society-of-Micro-Nano-Technology, Beijing, PEOPLES R CHINA, 2008-11-19
作者:  Du, Liqun;  Yu, Lichuan;  Song, Lei;  Liu, Chong
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/24


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