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	Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者: Huang, Ru; Ma, Haoran; Shang, Shengyan; Kunwar, Anil; Wang, Yunpeng 收藏 \| 浏览/下载：26/0 \| 提交时间：2019/12/02 Chip scale packages Copper Copper alloys Flip chip devices Grain boundaries Growth rate Size determination Soldered joints Substrates Tin alloys, Electronic product Grain boundary motions Interface reactions Lateral growth rates Longitudinal growth Packaging process Packaging technologies Solder composition, Soldering
	Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文 Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60 作者: Zhao, F.; Qiu, Y.; Jia, F.; Ma, H. 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/12/30 Ball grid arrays Chip scale packages Fatigue damage Soldered joints Stress analysis Thermal cycling Thermal stress Vibration analysis Coffin-Manson equation Electronic Packaging Fatigue lifetime Incremental damage superposition approach Plastic ball grid array packages Temperature environments Unified viscoplasticity Vibration loading Thermal fatigue
	Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262 作者: Jiang, Chengshuo; Fan, Jiajie; Qian, Cheng; Zhang, Hao; Fan, Xuejun 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/12/30 Chip-scale package (CSP) flip-chip die attach high-power light-emitting diode (LED) reliability voids
	Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者: Wang, Z.; Fan, J.; Liu, J.; Hu, A.; Qian, C. 收藏 \| 浏览/下载：11/0 \| 提交时间：2019/12/30 Chip scale packages Light emission Light emitting diodes Phosphors Silicones Ultraviolet radiation Viscosity Cure process Harsh environment High temperature cure Light emitting diode (LED) Low-power consumption Ultra-violet light Ultraviolet light intensity Ultraviolet-assisted Curing
	Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method 期刊论文 MATERIALS, 2017, 卷号: 10 作者: Qian, Cheng; Fan, Jiajie; Fang, Jiayi; Yu, Chaohua; Ren, Yi 收藏 \| 浏览/下载：8/0 \| 提交时间：2019/12/30 light-emitting diode chip scale package accelerated aging step stress test reliability qualification
	Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Nie, Zhiqiang; Wu, Di; Lu, Yao; Wu, Dhai; Wang, Shuna 收藏 \| 浏览/下载：85/0 \| 提交时间：2016/11/22 Chip scale packages Defects Degradation Electronics packaging High power lasers Laser beam welding Power semiconductor diodes Reliability Reliability analysis Semiconductor diodes
	A compact QCW conduction-cooled high power semiconductor laser array 会议论文 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Zhu, Qiwen; Zhang, Pu; Wang, Shuna; Wu, Dihai; Nie, Zhiqiang 收藏 \| 浏览/下载：26/0 \| 提交时间：2016/11/22 Chip scale packages Electronics packaging Finite element method High power lasers High temperature applications Temperature
	Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02 作者: Zeng, Q.; Guan, Y.; Su, F.; Chen, J.; Jin, Y. 收藏 \| 浏览/下载：7/0 \| 提交时间：2019/12/30 Chip scale packages Electronics packaging Finite element method Reliability Thermal cycling Viscoelasticity Chip deformations Relaxation modulus Silicon interposers Temperature dependent Thermal-mechanical reliability Time dependent Viscoelastic properties Williams-Landel-Ferry equations Three dimensional integrated circuits
	Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文 18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30 作者: Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/12/30 Chip scale packages Electronics packaging Failure (mechanical) Fatigue of materials Finite element method Shear stress Soldering Stresses Thermal load Timing circuits Global simulation Interfacial failures Load condition Maximum principal stress Resistance measurement Solder balls Thermal mechanical stress Thermal-mechanical reliability Three dimensional integrated circuits
	Vertically aligned carbon nanotubes transfer with glass frit 其他 2014-01-01 He, Jie; Zhan, Zhan; Du, Xiaohui; Chen, Shufen; Yu, Lingke; Zheng, Cheng; Wang, Lingyun; Sun, Daoheng; 王凌云; 孙道恒收藏 \| 浏览/下载：13/0 \| 提交时间：2015/07/22 Adhesion Carbon nanotubes Chip scale packages Glass MEMS Metals Nanotechnology

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