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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates 期刊论文 MICROGRAVITY SCIENCE AND TECHNOLOGY, 2016 Xu, Bingsheng; Chen, Junwei; Yuan, Zhangfu; Zang, Likun; Zhang, Lina; Wu, Yan 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Sn-3.0Ag-0.5Cu-xBi  Sessile drop method  Contact angle  Spreading dynamics  Interfaces  SN-AG-CU  LEAD-FREE SOLDERS  BI  ALLOYS  RELIABILITY  ELECTRONICS  HYSTERESIS  JOINTS  SYSTEM   Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016 Xu, Bingsheng; Wu, Yan; Zhang, Lina; Chen, Junwei; Yuan, Zhangfu 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/04 Surface morphology  Wettability  SAC  Lead-free solder  Surface evolver  V-shaped substrate  DYNAMIC CONTACT-ANGLE  LEAD-FREE SOLDERS  TEMPERATURE-COEFFICIENT  SURFACE-TENSION  NANOSTRUCTURED SURFACES  SIMULATION ANALYSIS  SN-AG  HYSTERESIS  DROPLETS  CU   Simulation analysis on surface morphology and hysteresis characteristics of molten Sn-3.0Ag-0.5Cu sitting on the inclined Ni substrate 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2014 Xu, Bingsheng; Yuan, Zhangfu; Wu, Yan 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10 Contact angle hysteresis  Spreading behavior  Surface morphology  Profile curve fitting  Surface Evolver simulation  TEMPERATURE-COEFFICIENT  SOLID-SURFACES  CONTACT ANGLES  LIQUID-DROPS  SN-AG  TENSION  PLANE  RETENTION  DROPLETS  SILICON   Preparation of TiCl_4 with multistage series combined fluidized bed 期刊论文 Transactions of Nonferrous Metals Society of China, 2013 Yuan Zhangfu; Zhu Yuanqing; Xi Liang; Xiong Shaofeng; Xu Bingsheng 收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03 combined fluidized bed  titanium tetrachloride  anti-agglomeration  MgO  CaO  MgCl_2  CaCl_2   Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2012 Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/12 Surfaces and interfaces  Intermetallics  Metals and alloys  Scanning electron microscopy (SEM)  Microstructure  LEAD-FREE SOLDERS  SN-AG-CU  SURFACE-TENSION  MOLTEN SILICON  WETTABILITY  SUBSTRATE  ALLOYS  DYNAMICS  SYSTEMS  AL   Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate 期刊论文 科学通报 英文版, 2012 Zang LiKun; Yuan ZhangFu; Zhan YaPeng; Wang ChenYu; Xu BingSheng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/12 molten metal and alloys  Pb-free solder  sessile drop method  kinetics  electronic materials  SURFACE-TENSION  WETTABILITY  INTERFACE  DYNAMICS  SYSTEMS  AL   Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K 期刊论文 应用表面科学, 2011 Zang, Likun; Yuan, Zhangfu; Xu, Hongyan; Xu, Bingsheng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/12 Pb-free solder  Sessile drop method  Contact angle  Electronic materials  LEAD-FREE SOLDERS  BI-SN SYSTEM  SURFACE-TENSION  CU  WETTABILITY  BEHAVIOR  ALLOYS  AG