CORC

在结果中检索

CORC

浏览/检索结果: 共41条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Effect of Ga Content on Microstructure and Degradability of Al-Mg-Ga-Sn Alloys 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 12, 页码: 4039-4045
作者:  Zhang Jianbin;  Liu Junjun;  Li Qinglin
收藏  |  浏览/下载：9/0  |  提交时间：2020/06/02
Preparation and characterization of methyl palmitate/palygorskite composite phase change material for thermal energy storage in buildings 期刊论文
CONSTRUCTION AND BUILDING MATERIALS, 2019, 卷号: 226, 页码: 212-219
作者:  Zhang, Hairong;  Zhang, Liquan;  Li, Qinglin;  Huang, Chao;  Guo, Haijun
收藏  |  浏览/下载：482/0  |  提交时间：2020/10/29
CO2 hydrogenation over acid-activated Attapulgite/Ce0.75Zr0.25O2 nanocomposite supported Cu-ZnO based catalysts 期刊论文
MOLECULAR CATALYSIS, 2019, 卷号: 476, 页码: 14
作者:  Guo, Haijun;  Li, Qinglin;  Zhang, Hairong;  Peng, Fen;  Xiong, Lian
收藏  |  浏览/下载：85/0  |  提交时间：2020/10/29
Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Industrial wastewater desalination under uncertainty in coal-chemical eco-industrial parks 期刊论文
RESOURCES CONSERVATION AND RECYCLING, 2019, 卷号: 145, 页码: 370-378
作者:  Huang, Liu;  Wang, Dongliang;  He, Chang;  Pan, Ming;  Zhang, Bingjian
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15
Microstructure and Properties of Al-Ga Alloys with Different Mg/Sn Ratios 期刊论文
Xiyou Jinshu/Chinese Journal of Rare Metals, 2019, 卷号: 43, 期号: 6, 页码: 592-597
作者:  Zhang, Jianbin;  Liu, Junjun;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2020/11/14
Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15

©版权所有 ©2017 CSpace - Powered by CSpace