CORC

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CORC

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Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs 其他
2016-01-01
Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Quality evaluation and simulation of through-multilayer TSV integration process for memory stacking 其他
2015-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Jin, Yufeng; Ma, Shenglin
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
Opportunities or risks to reduce labor in crowdsourcing translation? Characterizing cost versus quality via a PageRank-HITS hybrid model 其他
2015-01-01
Yan, Rui; Song, Yiping; Li, Cheng-Te; Zhang, Ming; Hu, Xiaohua
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill 其他
2015-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Seismic analysis of a water release integrated structure part I: Response spectrum analysis of intake tower 其他
2014-01-01
Wang, Yong; Lin, Zhen Ting; Song, Chao; Dong, Bo Ya; 宋超
收藏  |  浏览/下载：8/0  |  提交时间：2015/07/22
Using FAHP and D-S theory for evaluating the state of the product family 其他
2012-01-01
Hou, Liang; Lai, Rongshen; Wang, Haolun; Wu, Yongming; Huang, Wei; 侯亮; 黄巍
收藏  |  浏览/下载：2/0  |  提交时间：2015/07/22
Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles 其他
2011-01-01
Wang, Shan; Li, Zhiping
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/11

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