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Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载:20/0  |  提交时间:2018/06/05
What is the suitable segmentation crack density for atmospheric plasma sprayed thick thermal barrier coatings with the improved thermal shock resistance? 期刊论文
APPLIED SURFACE SCIENCE, 2018, 卷号: 431, 页码: 101, 111
作者:  Wang, L.;  Zhong, X. H.;  Shao, F.;  Ni, J. X.;  Yang, J. S.
收藏  |  浏览/下载:29/0  |  提交时间:2018/12/28
Preparation and thermal shock performance of thick alpha-Ta coatings by direct current magnetron sputtering (DCMS) 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2017, 卷号: 321, 页码: 19-25
Niu, Yunsong; Chen, Minghui; Wang, Jinlong; Yang, Lixin; Guo, Cean; Zhu, Shenglong; Wang, Fuhui
收藏  |  浏览/下载:21/0  |  提交时间:2017/08/17
A superior interfacial reliability of Fe-Ni UBM during high temperature storage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 期号: 12, 页码: 8537-8545
Gao, Li-Yin; Li, Cai-Fu; Wan, Peng; Liu, Zhi-Quan
收藏  |  浏览/下载:22/0  |  提交时间:2017/08/17


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