Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film

	Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film
	Enze Wang 1,2; Yutao Song 2; Lunlin Shang 2; Guangan Zhang 2; Shunhua Wang 1
刊名	Surface Topography: Metrology and Properties
	2022-10-19
期号	10 页码:045005
语种	英语
内容类型	期刊论文
源URL	[http://ir.licp.cn/handle/362003/29450]
专题	兰州化学物理研究所_固体润滑国家重点实验室
通讯作者	Lunlin Shang; Guangan Zhang
作者单位	1.School of Materials Science and Engineering, Lanzhou Jiaotong University 2.State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences
推荐引用方式 GB/T 7714	Enze Wang,Yutao Song,Lunlin Shang,et al. Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film[J]. Surface Topography: Metrology and Properties,2022(10):045005.
APA	Enze Wang,Yutao Song,Lunlin Shang,Guangan Zhang,&Shunhua Wang.(2022).Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film.Surface Topography: Metrology and Properties(10),045005.
MLA	Enze Wang,et al."Plasma surface pretreatment to improve interfacial adhesion strengths of sputtered Cu on polyimide film".Surface Topography: Metrology and Properties .10(2022):045005.