QQ客服 官方微博 反馈留言

	A fast and low computation consumption model for system-level thermal management in 3D IC
	Pi, Yudan ; Xu, Wenhua ; Jin, Yufeng ; Wang, Wei ; Wang, Ningyu ; Zhang, Jiaxi ; Luo, Guojie ; Miao, Min
	2016
关键词	thermal management 3D IC low computation
英文摘要	With the rapid increment of the power density and the introduction of vertical stack, heat dissipation has become a challenge issue. Thermal-aware placement thereby attracts more and more attentions for 3D IC. Meanwhile, as the keep-going scaling-down of IC, a huge computation consumption was caused by the large scale span. In this paper, an equivalent anisotropic thermal conductivity model was introduced to low down the computation consumption caused by the huge feature size difference. Correctness of this model was verified and the deviation from a full-scale simulation was less than 20%. By applying this model, thermal distribution of a designed 3D IC with 1566 TSVs and 80504 hot-spots was obtained with the total computation time of about 24 minutes in a regular personal computer.; EI; CPCI-S(ISTP); w.wang@pku.edu.cn; 1933-1939; 2016-August
语种	英语
出处	66th IEEE Electronic Components and Technology Conference (ECTC)
DOI标识	10.1109/ECTC.2016.159
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/449384]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Pi, Yudan,Xu, Wenhua,Jin, Yufeng,et al. A fast and low computation consumption model for system-level thermal management in 3D IC. 2016-01-01.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。